The 5th ISNM Forum on Manufacturing Paradigm III (5th FMP3): Frontiers and Advances
The 5th ISNM Forum on Manufacturing Paradigm III (5th FMP3), organized by the International Society for Nanomanufacturing (ISNM), sponsored by the International Academy of Engineering and Technology (AET) and hosted by the State Key Laboratory of Ultra-Precision Machining Technology at the Hong Kong Polytechnic University (PolyU), was successfully held in Hong Kong from 22 to 25 May 2026. Centered on the theme of Manufacturing Paradigm III (MP-III), the forum focused on recent advances in Atomic and Close-to-Atomic Scale Manufacturing (ACSM), and worked to bridge fundamental scientific research and emerging technological applications. More than 160 internationally renowned researchers from countries and regions around the world participated in the event. Distinguished speakers including E. Savio, President of ISNM, W. Guo, Member of the Chinese Academy of Sciences, Ö. Ganiyusufoğlu, Member of the German National Academy of Engineering, and B. Cheung from PolyU delivered plenary presentations on ACSM, ultra-precision machining, digital metrology, digital twins, and advanced manufacturing technologies.
At the opening ceremony, Z. Wang, Vice President of The Hong Kong Polytechnic University, delivered the welcome address. He emphasized that the forum is one of the most influential international innovation platforms in the field of atomic-scale manufacturing, driving knowledge exchange and cross-sector collaborations between academia and industry. X. Fu, Head of the Department of Industrial and Systems Engineering, noted that atomic and ACSM is fundamentally reshaping modern paradigms of product development and fabrication. He added that the department will actively advance long-term strategic investment in research at this critical frontier area.
Plenary Talks
Professor E. Savio, President of ISNM, delivered a comprehensive keynote address highlighting the deep integration of digital twin technologies and metrology in advanced manufacturing systems. He explained that digital twins enable real-time bidirectional synchronization between physical entities and their corresponding virtual models. By continuously incorporating measurement data, adaptive and dynamic model updating can be achieved, which substantially improves process optimization capabilities. However, obtaining reliable measurement data in harsh environments and on complex surfaces remains a major challenge, as measurement uncertainty directly impacts overall system performance. Professor Savio emphasized that the theory of the Three Paradigms of Manufacturing Advancement (TPMA) reveals the intrinsic laws governing manufacturing development and provides important guidance for the future advancement of the manufacturing sector.
Professor W. Guo, a member of the Chinese Academy of Sciences, presented a report on research in “Hydrovoltaic Intelligence” grounded in the concept of ACSM. Drawing inspiration from the strategies by which biological systems harvest energy, he examined the fundamental nature of natural intelligence and brain function, and compared these with the current development and challenges of artificial intelligence. Professor Guo noted that the human brain processes vast amounts of information at an extremely low power consumption of approximately 20 watts, achieving energy efficiency far surpassing that of existing AI chips. Based on the deep interconnections between water and life, as well as water and energy, he proposed Hydrovoltaic Intelligence as a new paradigm in which “intelligence” and “energy” co-evolve to guide future scientific, technological, and civilizational development. The presentation highlighted recent advances in hydrovoltaic effects (e.g., wave-induced potential and evaporation-induced potential), which enable the conversion of environmental energy into electricity, and also outlined future prospects for the role of confined water in brain science.
Professor Ö. Ganiyusufoğlu, a member of the German National Academy of Engineering, noted that traditional manufacturing technologies are approaching their fundamental physical limits. The ongoing miniaturization of electronic devices and the rise of quantum computing are creating completely new demands on manufacturing systems and processes. He emphasized that ACSM is the core enabling technology of Manufacturing Paradigm III, with the potential to break through existing technological bottlenecks and drive transformative innovation across multiple fields. ACSM will facilitate the development of new intelligent materials and medical technologies that are currently unimaginable, ultimately helping people achieve longer, healthier lives with higher quality. He stressed that ACSM represents a fundamental paradigm shift, rather than just an incremental extension of traditional manufacturing paradigms. Its advancement requires coordinated global collaboration between academia and industry.
Professor B. Cheung, Director of the State Key Laboratory of Ultra-Precision Machining Technology at The Hong Kong Polytechnic University, presented a multi-scale non-destructive intelligent inspection system developed for SiC wafers. SiC wafer surfaces have distinct multi-scale structural features: overall flatness deviations at the macro scale, local waviness fluctuations at the meso scale, and micro-scale surface roughness together with typical defects including scratches and pits. To mitigate the negative impact of these multi-scale features on critical manufacturing processes, the research team developed a multimodal non-destructive intelligent inspection platform that integrates variable-scale shear interferometry, super-resolution machine-vision microscopy, and intelligent global and subsurface defect extraction technologies. Through a single wavefront phase image acquisition, the system achieves both high lateral resolution and sufficient measurement sensitivity, providing an efficient and precise solution for SiC wafer inspection.
Professor S. To, Deputy Director of the State Key Laboratory of Ultra-Precision Machining Technology at The Hong Kong Polytechnic University, presented the recent research achievements of her team on multi-energy-field-assisted ultra-precision machining. Single-point diamond turning has emerged as a core technology for manufacturing high-precision optical components; however, processing hard-brittle and difficult-to-machine materials still presents major technical challenges. To address this gap, Professor To’s group systematically investigated the integration of magnetic, ultrasonic, laser, and electric fields into conventional ultra-precision machining processes. Their research elucidated material removal mechanisms under multi-field coupling conditions and enabled the development of innovative methods and technologies for fabricating functional micro- and nano-structured surfaces.
Keynote Speechs
Professor X. Luo from the University of Strathclyde provided a systematic review of the evolution of the Three Paradigms of Manufacturing Advancement, with particular emphasis on the scientific principles, key challenges, future applications, and the roles of digital twins and artificial intelligence in ACSM development. Professor R. Zhang from Soochou Laboratory presented a novel AI4S-MDS and machine-learning-based framework for lithography material discovery. By jointly optimizing exposure and development spaces, his team successfully developed a high-performance negative-tone developer. Dr. R. Su from the Shanghai Institute of Optics and Fine Mechanics proposed a development pathway for picometer-level three-dimensional optical profilometry based on physical modeling and optical design, to meet the ultra-precision metrology requirements of EUV lithography mirrors and synchrotron X-ray mirrors.Professor K. Liu from the Nanjing University of Aeronautics and Astronautics discussed potential pathways for advancing ultra-precision machining toward ACSM, with a focus on atomic-scale material removal mechanisms and associated technological challenges.Professor L. Kong from Fudan University introduced nano- and sub-nanometer optical metrology techniques based on the integration of dark-field heterodyne interferometric scattering and weak-measurement-enhanced Goos–Hänchen effects. These techniques enable the detection of 5-nm scatterers and achieve sub-nanometer lateral resolution.
Dr. Z. Liu from the Chinese Academy of Sciences reported a laser-assisted solid-phase synthesis technique for atomically dispersed metal materials. Through a laser-induced carrier-defect anchoring mechanism, controllable fabrication of single atoms, dual atoms, and atomic clusters was achieved. Professor R. Chen from Huazhong University of Science and Technology presented quantum-dot architectures engineered via atomic-layer infiltration. By stabilizing quantum-dot surfaces and suppressing non-radiative recombination, the team developed high-fidelity wearable pulse-wave sensors. Professor H. Deng from Southern University of Science and Technology introduced atomic-scale surface reconstruction methods based on plasma-induced surface annealing and tribochemistry-induced surface patterning, which enable the production of atomically smooth semiconductor surfaces. Professor J. Xu from Huazhong University of Science and Technology reviewed laser applications in the ultra-precision machining of hard and brittle materials, including laser-assisted cutting, laser polishing, and ultrafast laser micro/nanofabrication. Professor Z. Liao from the University of Nottingham proposed an inverse-problem-based laser modulation strategy. By optimizing laser scanning trajectories and velocity distributions, thermal fields can be precisely controlled, which significantly improves the quality of laser welding and additive manufacturing processes.
Professor S. Yang from Xi’an Jiaotong University presented nanoprobe-based metrology technologies. Through probe optimization and plasmonic enhancement, the team improved measurement resolution to approximately 5 nm, with future prospects extending to sub-nanometer scales. Professor H. Zhao from PolyU introduced the OSCAR AI+ robotic laboratory platform. By integrating large language models, digital twins, and robotic agents in a closed-loop framework, the platform enables fully automated manufacturing of perovskite solar cells and supports IEEE standardization efforts. Professor X. Chen from Soochou Laboratory developed two multimodal large language models for chemistry and materials science: ChemDFM and ChemDFM-X. These models can interpret molecular representations, spectral data, and other types of scientific data modalities, serving as intelligent assistants for materials discovery and design. Professor Y. Chen and his team at Zhejiang University developed an intelligent diamond cutting tool that supports simultaneous temperature sensing and thermal regulation. The tool enables direct thermal monitoring and control within nanoscale cutting zones, improving ductile-regime machining efficiency and surface quality via thermal softening effects.
Summary
Invited Presentations
Professor J. Sun from Dalian University of Technology proposed a scalable micro/nanomanufacturing framework for functional surfaces by integrating top-down template-based fabrication with bottom-up ACSM atomic regulation. The framework enabled the fabrication of mechanically durable and highly sensitive superhydrophobic coatings and flexible sensors. Professor Y. Hu from the University of Science and Technology of China presented femtosecond-laser-enabled atomic-scale manufacturing technologies. Through digital holographic wavefront modulation and aberration compensation, the existing bottlenecks in processing efficiency and focusing control were overcome, enabling nanoscale and near-atomic-scale material modification and removal. Associate Professor P. Lyu from the Chinese Academy of Sciences reported a plasma-assisted cutting method. By regulating grain coarsening and near-surface purification, grain-boundary steps and impurity-induced scratches in soft metals and alloys were effectively suppressed, significantly reducing surface roughness and defect density.
Professor C. Wang from PolyU developed an air-jet-driven chemical mechanical polishing technique that transforms conventional jet machining into an elastic chemo-mechanical synergistic removal process. Atomic-level polishing of single-crystal silicon and optical glass was achieved, with surface roughness below 0.2 nm, no subsurface damage, and form accuracy maintained at 0.1 μm. Professor C. Zhao from Harbin Institute of Technology introduced a suite of precision positioning instruments developed under a “point–surface–space” framework, including a laser tool setter, planar positioning accuracy analyzer, and five-axis motion analyzer, which have been successfully applied to CNC machine calibration and semiconductor wafer inspection. Associate Professor M. Lai from Tianjin University systematically investigated the material removal, damage formation, and chemical reaction mechanisms of laser crystal Lu₂O₃ during atomic-scale cutting, grinding, polishing, and chemical mechanical polishing through molecular dynamics simulations.Dr. Y. He from University College Dublin employed AFM-based dynamic nanolithography to achieve controllable removal of multiple atomic layers from single-crystal silicon through cyclic low-peak-force indentation, and established a physics-based material removal model based on transition frequencies and energy barriers.
Professor W. S. Yip from PolyU demonstrated magnetic-field-assisted diamond machining. By suppressing vibration, reducing material thermal expansion, and leveraging eddy-current damping effects, this technique enables the precise fabrication of micro- and nanostructures on difficult-to-machine materials, while endowing the processed surfaces with excellent stable superhydrophobic properties. Professor H. Zhang from Beijing University of Technology proposed an ACSM-based electroforming replication technology. Based on the principle of electrochemical atomic deposition, the process achieves controlled regulation of atomic nucleation, diffusion, and growth through electric double layer adjustment and nano-pulse current modulation, enabling low-cost, scalable replication of atomically smooth large-area surfaces. Professor J. Yang from Huazhong University of Science and Technology resolved the problem of corner deviations in pseudo-random polishing trajectories. By integrating material removal models into customized spline curve generation and introducing a new contact force compensation method, the team suppressed mid-spatial-frequency errors while retaining high form accuracy, enabling deterministic polishing of electroless nickel-phosphorus-coated metal mirrors.
Professor Z. Cao from Tianjin University proposed a graphene-oxide-enhanced photocatalysis-assisted polishing process for advanced hard and brittle ceramic optical components. Experimental studies verified its processing advantages and broad applicability, while revealing the photocatalytic-chemical-mechanical synergistic material removal mechanism. Dr. W. Zhang from University College Dublin investigated nonlinear interfacial transport behavior in atomic-scale metal-metal junctions using conductive atomic force microscopy. It was found that variations in contact configurations induce resistive-switching-like phenomena, which provides a new framework for understanding the failure mechanisms of Ohmic contacts in atomic-scale electronic systems. Professor J. Cui from Xi’an Jiaotong University focused on carbon-nanotube-based transistors for integrated circuits. Leveraging advances in nanochannel fabrication, ordered self-assembly of carbon nanotubes, and controllable interconnection, he developed laser-based micro- and nanomanufacturing methods and elucidated their underlying mechanisms. This work aims to overcome performance bottlenecks of carbon-based semiconductor devices and establish disruptive technological pathways for integrated circuits in the post-Moore era.
(Prepared by C. Chen, C. Gu, P. Cao, H, An, N. Yu, Y. Yang)